To challenging micro-machining problems using Synova Laser Microjet technology to cut and machine a variety of hard brittle materials. Our customers are global and come from Singapore to South Africa.

Creative solutions to challenging micromachining problems, using precision diamond dicing blades. To cut and machine a variety of hard brittle materials. To be one of the fastest quick turn dicing. Shops in the world, filling a critical customer need for fast, high quality work. For excellence has resulted in an impressive customer base of whom it feels extremely proud. To see what we can do. 169; 2000 - American Precision Dicing, Inc.

Ever since Edison gave us the light bulb, our lives have been illuminated in more way than we could have ever imagined. Could we still maintain the level of communication that seems to outpace our needs? That is why we are waking up to the reality that we must find and use cleaner and safer sources for energy.

Its rotating distal gripping tips is a feature that allows for random access of 200mm wafers into small pitch cassette, boat or any narrow gates. Vortex and Edge Gripper for thin wafer. This vortex end effector provides superior handling of all types of wafers, including thin wafers, with no contact between the wafer and end effectors.

Wafer products Wafer machines Wafer shapes. With a focus on wafer machines. Special Machines - Wafer Products - Wafer Machines - Wafer Shapes. Lippl-Special Mechanical Engineering - Company and Office.